Kapasite PCB

Komisyon Konsèy sikwi enprime yo se poto a nan pwodwi elektwonik, li trè enpòtan pou pwodwi ou yo ka kouri estab pou yon tan long oswa ou pa.Kòm yon manifakti pwofesyonèl PCB ak PCB Asanble, PCBFuture mete yon gwo valè sou bon jan kalite a nan tablo sikwi.

PCBFuture kòmanse soti nan biznis PCB Fabrication, Lè sa a, pwolonje nan asanble PCB ak konpozan apwovizyone sèvis, kounye a te vin youn nan pi bon manifakti asanble PCB en.Nou fè anpil efò pou envesti nan ekipman avanse pou pi bon teknoloji, optimize sistèm entèn pou pi bon efikasite, pèmèt travay yo pou pi bon ladrès.

Pwosesis Atik Kapasite Pwosesis
Enfòmasyon de baz Kapasite pwodiksyon Konte kouch 1-30 kouch
Bow ak tòde 0.75% estanda, 0.5% avanse
Min.fini gwosè PCB 10 x 10mm (0.4 x 0.4")
Max.fini PCB gwosè 530 x 1000mm (20.9 x 47.24 ")
Multi-press pou avèg/antere vias Multi-press Cycle≤3 fwa
Fini epesè tablo 0.3 ~ 7.0mm (8 ~ 276mil)
Fini tolerans epesè tablo +/-10% estanda, +/-0.1mm avanse
Sifas fini HASL, HASL san plon, Flash lò, ENIG, Hard plating lò, OSP, Immersion Tin, Immersion ajan, elatriye
Fini sifas selektif ENIG+Gold finger, Flash Gold+Gold dwèt
Kalite materyèl FR4, Aliminyòm, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, elatriye. Epitou ka achte materyèl yo kòm demann
Foil kwiv 1/3oz ~ 10oz
Kalite Prepreg FR4 Prepreg, LD-1080(HDI) 106, 1080, 2116, 7628, elatriye.
Tès serye Peel fòs 7.8N/cm
Famabilite 94V-0
Kontaminasyon ionik ≤1ug/cm²
Min.epesè dyelèktrik 0.075mm (3mil)
Tolerans enpedans +/-10%, min ka kontwole +/- 7%
Entèn kouch & Eksteryè kouch Imaj Transfè Kapasite machin Scrubbing machin Epesè materyèl: 0.11 ~ 3.2mm (4.33mil ~ 126mil)
Gwosè materyèl: min.228 x 228mm (9 x 9")
Laminateur, Ekspozisyon Epesè materyèl: 0.11 ~ 6.0mm (4.33 ~ 236mil)
Gwosè materyèl: min 203 x 203mm (8 x 8"), max. 609.6 x 1200mm (24 x 30")
Liy grave Epesè materyèl: 0.11 ~ 6.0mm (4.33mil ~ 236mil)
Gwosè materyèl: min.177 x 177mm (7 x 7")
Kouch Entèn Pwosesis Kapasite Min.lajè liy enteryè / espas 0.075/0.075mm (3/3mil)
Min.espas ki soti nan kwen twou a kondiktif 0.2mm (8mil)
Min.kouch anndan bag annulaire 0.1mm (4mil)
Min.clearance izolasyon kouch enteryè 0.25mm (10mil) estanda, 0.2mm (8mil) avanse
Min.espas ki soti nan kwen tablo a kondiktif 0.2mm (8mil)
Min.lajè diferans ant tè kwiv 0.127mm (5mil)
Dezekilib kòb kwiv mete epesè pou nwayo enteryè H/1oz, 1/2oz
Max.fini epesè kòb kwiv mete 10oz
Kouch ekstèn Pwosesis Kapasite Min.lajè liy ekstèn / espas 0.075/0.075mm (3/3mil)
Min.gwosè pad twou 0.3mm (12mil)
Kapasite Pwosesis Max.gwosè tenting plas 5 x 3mm (196.8 x 118mil)
Max.gwosè twou tant 4.5mm (177.2mil)
Min.tant lajè tè 0.2mm (8mil)
Min.bag annulaire 0.1mm (4mil)
Min.BGA anplasman 0.5mm (20mil)
AOI Kapasite machin Orbotech SK-75 AOI Epesè materyèl: 0.05 ~ 6.0mm (2 ~ 236.2mil)
Gwosè materyèl: max.597 ~ 597mm (23.5 x 23.5")
Orbotech Ves machin Epesè materyèl: 0.05 ~ 6.0mm (2 ~ 236.2mil)
Gwosè materyèl: max.597 ~ 597mm (23.5 x 23.5")
Perçage Kapasite machin MT-CNC2600 Drill machin Epesè materyèl: 0.11 ~ 6.0mm (4.33 ~ 236mil)
Gwosè materyèl: max.470 ~ 660mm (18.5 x 26")
Min.gwosè egzèsis: 0.2mm (8mil)
Kapasite Pwosesis Min.gwosè ti jan milti-frape 0.55mm (21.6mil)
Max.rapò aspè (gwosè tablo fini VS gwosè egzèsis) 12:01
Tolerans kote twou (konpare ak CAD) +/-3mil
Twou Counterbore PTH & NPTH, Top ang 130 °, Top dyamèt <6.3mm
Min.espas ki soti nan kwen twou a kondiktif 0.2mm (8mil)
Max.gwosè ti jan fè egzèsis 6.5mm (256mil)
Min.gwosè plas milti-frape 0.45mm (17.7mil)
Tolerans gwosè twou pou anfòm laprès +/-0.05mm (+/-2mil)
Min.PTH tolerans gwosè plas +/-0.15mm (+/-6mil)
Min.Tolerans gwosè NPTH plas +/-2mm (+/-78.7mil)
Min.espas ki soti nan kwen twou a kondiktè (vias avèg) 0.23mm (9mil)
Min.gwosè egzèsis lazè 0.1mm (+/-4mil)
Countersink twou ang & Dyamèt Top 82,90,120°
Pwosesis mouye Kapasite machin Panel & Modèl plating liy Epesè materyèl: 0.2 ~ 7.0mm (8 ~ 276mil)
Gwosè materyèl: max.610 x 762mm (24 x 30 ")
Ebavure Maching Epesè materyèl: 0.2 ~ 7.0mm (8 ~ 276mil)
Gwosè materyèl: min.203 x 203mm (8 "x 8")
Desmear Line Epesè materyèl: 0.2mm ~ 7.0mm (8 ~ 276mil)
Gwosè materyèl: max.610 x 762mm (24 x 30 ")
Liy plating fèblan Epesè materyèl: 0.2 ~ 3.2mm (8 ~ 126mil)
Gwosè materyèl: max.610 x 762mm (24 x 30 ")
Kapasite Pwosesis Twou miray epesè kwiv mwayèn 25um (1mil) estanda
Fini epesè kwiv ≥18um (0.7mil)
Min lajè liy pou grave make 0.2mm (8mil))
Max.finished pwa kòb kwiv mete pou kouch enteryè & ekstèn 7oz
Diferan epesè kwiv H/1oz, 1/2oz
Soude Mask & Sérigraphie Kapasite machin Scrubbing machin Epesè materyèl: 0.5 ~ 7.0mm (20 ~ 276mil)
Gwosè materyèl: min.228 x 228mm (9 x 9")
Ekspozisyon Epesè materyèl: 0.11 ~ 7.0mm (4.3 ~ 276mil)
Gwosè materyèl: max.635 x 813mm (25 x 32")
Devlope machin Epesè materyèl: 0.11 ~ 7.0mm (4.3 ~ 276mil)
Gwosè materyèl: min.101 x 127mm (4 x 5")
Koulè Koulè mask soude Vèt, ma vèt, jòn, nwa, ble, wouj, blan
Koulè silkscreen Blan, jòn, nwa, ble
Kapasite Mask soude Min.ouvèti mask soude 0.05mm (2mil)
Max.ploge atravè gwosè 0.65mm (25.6mil)
Min.lajè pou kouvèti liy pa S/M 0.05mm (2mil)
Min.soude mask lejand lajè 0.2mm (8mil) estanda, 0.17mm (7mil) avanse
Min.epesè mask soude 10um (0.4mil)
Soude epesè mask pou via tant 10um (0.4mil)
Min.lajè liy lwil oliv kabòn / espas 0.25/0.35mm (10/14mil)
Min.traser nan kabòn 0.06mm (2.5mil)
Min.tras liy lwil oliv kabòn 0.3mm (12mil))
Min.espas ki soti nan modèl kabòn ak kousinen 0.25mm (10mil)
Min.lajè pou peelable mask kouvri liy / pad 0.15mm (6mil)
Min.soude mask pon lajè 0.1mm (4mil))
Soude mask dite 6H
Kapasite Peelable Mask Min.espas ki soti nan modèl mask peelable nan pad 0.3mm (12mil))
Max.gwosè pou twou tant mask peelable (Pa enprime ekran) 2mm (7.8mil)
Max.gwosè pou twou tant mask peelable (Pa enprime aliminyòm) 4.5mm
Peelable mask epesè 0.2 ~ 0.5mm (8 ~ 20mil)
Kapasite Silkscreen Min.lajè liy silkscreen 0.11mm (4.5mil)
Min.wotè liy silkscreen 0.58mm (23mil)
Min.espasman soti nan lejand pad 0.17mm (7mil)
Sifas fini Kapasite Sifas Fini Max.longè dwèt lò 50mm (2")
ENIG 3 ~ 5um (0.11 ~ 197mil) nikèl, 0.025 ~ 0.1um (0.001 ~ 0.004mil) lò
dwèt lò 3 ~ 5um (0.11 ~ 197mil) nikèl, 0.25 ~ 1.5um (0.01 ~ 0.059mil) lò
HASL 0.4um (0.016mil) Sn/Pb
HASL machin Epesè materyèl: 0.6 ~ 4.0mm (23.6 ~ 157mil)
Gwosè materyèl: 127 x 127mm ~ 508 x 635mm (5 x 5 "~ 20 x 25")
Hard plating lò 1-5u"
Immersion Eten 0.8 ~ 1.5um (0.03 ~ 0.059mil) Eten
Immersion Silver 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag
OSP 0.2 ~ 0.5um (0.008 ~ 0.02mil)
E-tès Kapasite machin vole sonde tèsteur Epesè materyèl: 0.4 ~ 6.0mm (15.7 ~ 236mil)
Gwosè materyèl: max.498 x 597mm (19.6 ~ 23.5")
Min.espas ant pad tès ak kwen tablo a 0.5mm (20mil)
Min.rezistans konduktif
Max.rezistans izolasyon 250mΩ
Max.tès vòltaj 500V
Min.gwosè pad tès la 0.15mm (6mil))
Min.tès pad ak espas pad 0.25mm (10mil)
Max.tès aktyèl 200mA
Profilage Kapasite machin Kalite profilage NC routage, V-koupe, onglè plas, twou koupon pou achte
NC routage machin Epesè materyèl: 0.05 ~ 7.0mm (2 ~ 276mil)
Gwosè materyèl: max.546 x 648mm (21.5 x 25.5")
V-koupe machin Epesè materyèl: 0.6 ~ 3.0mm (23.6 ~ 118mil)
Maksimòm lajè materyèl pou koupe V: 457mm (18 ")
Kapasite Pwosesis Min.gwosè bit routage 0.6mm (23.6mil)
Min.deskripsyon tolerans +/-0.1mm (+/-4mil)
Kalite ang V-koupe 20°, 30°, 45°, 60°
V-koupe ang tolerans +/-5°
V-koupe tolerans anrejistreman +/-0.1mm(+/-4mil)
Min.lò dwèt espas +/-0.15mm (+/-6mil)
Tolerans ang bizote +/-5°
Bizote rete tolerans epesè +/-0.127mm (+/-5mil)
Min.reyon enteryè 0.4mm (15.7mil)
Min.espas ki soti nan kondiktif nan deskripsyon an 0.2mm (8mil)
Tolerans pwofondè Countersink/Counterbore +/-0.1mm (+/-4mil)